INDIAN INSTITUTE OF TECHNOLOGY TIRUPATI
                   भारतीय प्रौद्योगिकी संस्थान तिरुपति

INDIAN INSTITUTE OF TECHNOLOGY TIRUPATI
भारतीय प्रौद्योगिकी संस्थान तिरुपति
Policies      RTI      SC/ST/OBC Liaison Officers/Cell               


  • The Physics Department and ISRO are organized a one-day seminar series "AKASH" on 4th November, 2023.


  • The Physics Department and ISRO are organized a one-day seminar series "AKASH" on 4th November, 2023.
  •  

     
    The Twenty-Ninth International Conference on Processing and Fabrication of Advanced Materials (PFAM-XXIX)
     
  •  

     
    The Twenty-Ninth International Conference on Processing and Fabrication of Advanced Materials (PFAM-XXIX)
     
  •  

     
    The Twenty-Ninth International Conference on Processing and Fabrication of Advanced Materials (PFAM-XXIX)
     
  •  

     
    MoU with Indian Institute of Information Technology, Design and Manufacturing, Kancheepuram (IIITDM)
     
  •  

     
    Distinguished Lecture by Prof. Rao R Tummala, Georgia Institute of Technology
     
  •  

     
    77th Independence Day Celebration
     


  • 5-day Workshop on Finite Element Methods: Theory and Practice.


  • Inauguration of the Institute Main Gate and Administrative Building.


  • Inauguration of the Institute Main Gate and Administrative Building.

Please enter the email address for your account. A verification code will be sent to you. Once you have received the verification code, you will be able to choose a new password for your account.

AWARDS

PUBLICATIONS

View All Publications

  • Prabhleen Kukreja and V. Mahendran, “PraaKrum: A Practical Byzantine-Resilient Federated Learning Algorithm”, Accepted in COMSNETS ’24: 16th IEEE International Conference on Communication Systems and Networks, India, January 2024.

  • Bhargav Chandan Palivela, Ravi Sankar Mamilla. Sintering energy conservation in extrusion-based 3D printing of porcelain ceramics blended with copper and allied alloys: A sustainable approach, Ceramic International, 2023, DOI: 10.1016/j.ceramint.2023.10.204

  • Siva Prasad Tadi, Shanmukha Srinivas Maddula, Ravi Sankar Mamilla, Sustainability aspects of composite filament fabrication for 3D printing applications, Renewable and Sustainable Energy Reviews, 2023, DOI: 10.1016/j.rser.2023.113961

  • Biswal, D. and Bahinipati, C.S. Crop-insurance adoption and impact on farm households’ well-being in India: evidence from a panel study. Journal of the Asia Pacific Economy, 2023. DOI: 10.1080/13547860.2023.2266204.

  • Tirumala, Tumula, Ajay Kumar, and Chandra Shekhar Perugu. "Reverse cladding of 304 stainless steel to LM25 aluminium alloy through die-casting." Materials Letters (2023): 134896. Link.

  • Anup Basak (2023) Grain boundary- and triple junction-induced martensitic transformations: A phase-field study of effects of grain boundary width and energy. International Journal of Solids and Structures. doi.org/10.1016/j.ijsolstr.2023.112308.

  • Anup Basak, Valery Levitas (2023) A multiphase phase-field study of three-dimensional martensitic twinned microstructures at large strains. Continuum Mechanics and Thermodynamics. doi.org/10.1007/s00161-022-01177-6.

  • Shaik, Mujahid, and Balaji Subramanian. "Computational investigation of NREL Phase-VI rotor: Validation of test sequence-S measurements." Wind Engineering (2023):https://doi.org/10.1177/0309524X231169298.

  • Subhadeep De (IUCAA Pune) and Arijit Sharma (IIT Tirupati), “Indigenisation of the Quantum Clock: An Indispensable Tool for Modern Technologies”, Atoms 2023, 11(4), 71; https://doi.org/10.3390/atoms11040071.

  • Naresh Babu Kakarla and V. Mahendran, “Lyapunov Meets Thompson: Learning-Based Energy-Efficient UAV Communication with Queuing Stability Constraints”, IEEE INFOCOM DRONECOM Workshop on Drone-Assisted Wireless Communications for 5G and Beyond, New York, USA, May, 2023.

  • Rohit Gupta, V. Mahendran, and B. Venkataramana, “ Optimal Searching of Prefetched DASH Segments in Fog Nodes: A Multi-Armed Bandit Approach”, Proceedings of the 17th ACM Symposium on QoS and Security for Wireless and Mobile Networks, Spain, Nov, 2021.

  • Hemant Kumar Singh, Balaji Subramanian, N. Kusuma and S. Harsha. “Parametric optimization and analysis of pressure sensor chip membrane using design of experiments (DOE).” Manufacturing Technology Today (MTT) Journal: National Conference on Micro Systems Technology - 2020. Vol. 19. Issue 9.

  • Reddy, H., & Subramanian, B. (2022). Aerodynamic Design of Three-Dimensional Bellmouth for Low-Speed Open-Circuit Wind Tunnel. International Journal of Aerospace and Mechanical Engineering, 16(10), 241-255.

  • Venigalla, A. S. M., Vagavolu, D., & Chimalakonda, S. (2022, January). SurviveCovid-19-an educational game to facilitate habituation of social distancing and other health measures for covid-19 pandemic. International Journal of Human–Computer Interaction, 1-13.

  • Agrahari, V., & Chimalakonda, S. (2022, February). A Catalogue of Game-Specific Anti-Patterns. In 15th Innovations in Software Engineering Conference (pp. 1-10).

  • Gupta, N., Rajput, A., & Chimalakonda, S. (2022, May). COSPEX: A Program Comprehension Tool for Novice Programmers. To Appear In 2022 IEEE/ACM 44th International Conference on Software Engineering: Companion Proceedings (ICSE-Companion).

  • Venigalla, A. S. M., Boyalakunta, K., & Chimalakonda, S. (2022, May). GitQ-Towards Using Badges as Visual Cues for GitHub Projects. To Appear in Proceedings of 2022 IEEE/ACM 30th International Conference on Program Comprehension (ICPC).

  • Shanbagh, S., Chimalakonda, S., Sharma, V. S., & Kaulgud, V. (2022, June). Towards a Catalog of Energy Patterns in Deep Learning Development. To Appear In Proceedings of the Evaluation and Assessment in Software Engineering (EASE).

  • Das, D., Mathews, N. S., & Chimalakonda, S. (2022, June). Exploring Security Vulnerabilities in Competitive Programming: An Empirical Study. To Appear In Proceedings of the Evaluation and Assessment in Software Engineering (EASE).


    • Contact